Clean Room Equipments
• Semiconductor manufacturing equipments
• Vacuum & Gas / Vacuum Sealers
• Diffusion Furnaces for Semiconductors (1100 °C),
• LTCC Sintering Press
• Laser Decapsulation & Failure Analysis
• Plasma Decapsulation
• Thermal Processing Technology
• Automatic Robotic Soldering
• SMT Lead Forming
• Wire Bonding Systems
• Full Automatic / Desktop Wire Bonding and Test Systems
• Furnaces (up to 600 °C)
• Clean Room Furnaces
• Dispenser Controllers
• FA Equipments
• Desktop Robots
• Manual / Semi-automatic / Full-automatic Die Bonding Systems
• Wire Bond Inspection – AOI